首頁    層合機    CH25-35B層合機
CH25-35B層合機

CH25-35B層合機

該機主要用于智能卡及普通卡的層合工藝。該設備體積小、重量輕,適用于小型卡廠的生產及大、中型卡廠的前期層合試驗。

該機主要用于智能卡及普通卡的層合工藝。該設備體積小、重量輕,適用于小型卡廠的生產及大、中型卡廠的前期層合試驗。

●技術參數

額定壓力:18MPa

電源電壓:三相AC380V   50Hz  

壓力精度:0.1Mpa

版面尺寸:250mm×350mm

數:冷熱各5層

電熱控制:穩定溫度±1℃

   量:1500kg

外型尺寸:1600mm(L)×600(W)×1500mm(H)

 

 

 

CH25-35B Lamination Machine

This is for laminating of smart cards and ordinary cards. It is a small and light-weight machine which is suitable for the production of small card factories and the pre-laminated test of the medium-sized and the large card factories.

Echnical parameter

   Rated Pressure18Mpa

   Power Voltage3 Phase AC380V 50Hz

   Pressure precision0.1Mpa

   Laminating Area: 420mm*520mm

   Opening: Cold/Hot in 5 tower each

   Electric Heating control +/- 1C

Weight1500kg

Dimension 1600mm(L)×600(W)×1500mm(H)


在线A片永久免费看不卡国产